About FPC:

Flexible Printed Circuit is abbreviated to FPC, like PCB it has single-sided, double-sided and multi-layer distinction. FPC is made on flexible dielectric substrates, like various Polymeric materials, therefore it has properties of lightweight, soft, thinness, smallness, ductility, flexibility and high wiring density. It can be easy to bend, fold, wind and flex in 3D space to reduce electronic device size and weight therefore it is widely used creating products that are complex, compact and lightweight. Today FPC is usually applied to the products like cell phone, laptop, display screen, consumer electronics, and contactable panel and IC integration etc.

FPC Material:

The dielectric material used in FPC is usually polyimidePI film, Polyester PET film and Polytetrafluoroethylene PTFE film, but most common for FPC substrate is PI film.

FPC Copper type:

The normal FPC copper are RA Cu and ED Cu, RA has good ductibility than ED, the extension of RA is 20%-45%, ED is 4%-40%. ED has advantage to make fine line board, but easily to be fractured when bend radius less than 5mm or dynamic deflection, therefore considering the good ductibility, most customers will choose RA Cu for FPC processing.

Advantages of FPC:
FPC Flexible Printed Circuit is made on flexible dielectric substrate, has many unique advantages compared with hard printed circuit:

1 Easy to bend, fold, wind and flex in 3D space, therefore it can be integrative with components and leads.

2 Largely reduce electronic products size and weight, meeting the requirements for high wiring density, reliability and miniaturization. So it has been widely used in spaceflight, military, mobile communication, portable computer, computer peripheral equipments, PDA, digital camera, etc.

3 Good heat dissipation, weld ability, and connectivity, low composite cost and new combination of flexible and hard which fill the lack in carrying capacity of flexible material.

  FPC Capability: